Amkor Technology offers a wide variety of flip chip interconnect options for conventional and next-generation packaging including wafer level stand-alone die (WLP), chip scale packages (fcCSP), ball and land grid arrays (FCBGA, fcLGA), molded packages, and 2.5/3D through silicon via (TSV) platforms. Fine pitch copper pillar bumping is an interconnect option that is exploding onto the packaging scene. Our copper pillar flip chip enables high performance solutions for single and stacked die packages.

Arc Technologies is both a manufacturer and an engineering partner, helping you to develop and produce flip chip products. Arc produces flip chip tooling to your specifications, including high precision machining of silicon carbide as required. In-house flip chip aligner-bonder offers precision and versatility for your assemblies. As your development and assembly partner, ARC can serve your flip chip needs from first prototypes to production products.

Dr. Flip Chip: George Riley – Writing and Editing. Hire an experienced writer who knows the technology. Over 30 years writing and editing technical, marketing and business articles, white papers, and web content. Forty years semiconductor and microelectronics research, engineering, marketing, manufacturing, and management. Original creator of FlipChips.com.

FINETECH provides unique, versatile equipment solutions for flip chip bonding, sub-micron accuracy microelectronic and opto-electronic placement, and advanced rework. Flip chip bonding technologies include eutectic and AuSn soldering, thermo-compression, thermo-sonic / ultrasonic bonding, adhesive, ACP and Chip On Glass.   FINETECH’s modular approach allows customization of all systems and provides process flexibility.  Ideal for R&D and prototyping through production environments.

SET is a leader in manufacturing high accuracy device bonders that perform all flip chip processes: compression, thermocompression, in-situ reflow (joint shaping) and mass reflow, as well as tacking and fiber placement, micro-mechanical assembly, die attach, and substrate to substrate bonding.  With post bonding accuracies down to ± 0.5µm, and leveling capabilities of 2.5 microradians, SET bonders are suited to today’s 3D integration, IR-FPA, MEMS, and photonics packaging markets.