LinkedIn® Flip Chip and WLCSP Group. Flip chip and WLCSP is the gray area between the fab and back end assembly. A merger of both those worlds, this forum is designed to help those that want to exchange ideas, educate and expand the technology.
SEMI® is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, including: semiconductors, photovoltaics (PV), LED, Flat Panel Display (FPD), Micro-electromechanical systems (MEMS), Printed and flexible electronics and related Micro- and Nano-electronics.
The International Microelectronics And Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education — symposia, conferences, workshops, professional development courses and other efforts.
Institute of Electrical and Electronics Engineers is the world’s largest professional association dedicated to advancing technological innovation. Highly cited publications, conferences, technology standards, and professional and educational activities.
MicroElectronics Packaging and Test Engineering Council is a trade association of semiconductor suppliers, manufacturers and vendors involved in packaging, assembly and test.
Information portal for the MEMS and Nanotechnology community hosted by the MEMS and Nanotechnology Exchange (MNX) — a leading provider of high-quality foundry and consulting services and comprehensive solutions for MEMS, micro- and nano-technologies.
MEMS Industry Group® (MIG) is the trade association advancing MEMS across global markets, enabling the exchange of non-proprietary information among members, providing access to reliable industry data and promoting greater commercial development and use of MEMS and MEMS-enabled devices.