The research firm Yole Développement is heavily involved in the Flip Chip / Advanced Packaging area.
Up-to-date information on Flip Chip industry and related technologies
Throughout the year, 3D Packaging observes and analyzes its complex ecosystem with in-depth
testimonials from Yole Développement analysts and key industry players.
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Many applications, different drivers, several bumping technologies, varying die and package sizes and different sourcing strategies make Flip Chip one of the most diversified and interesting platforms. Despite its highly respectable age, Flip Chip is still in mutation and provides continuously innovative fine pitch bumping solutions to serve the most advanced packaging technologies.
This webcast is available in I-Micronews.com archives section. Please click Here to watch it.
Deep analysis of the Flip Chip industry
Yole Développement publishes a comprehensive collection of applications & technology analysis and databases in numerous domains.
Flip-Chip Market and Technology Trends
Cu pillar and micro-bumping for memory, consumer electronics and mobile phones have reinvigorated the Flip-Chip market, enabling it to grow at a 19% rate and cater to the most advanced technologies, like 3DIC and 2.5D.
Publication date : Mar. 2013
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