These centers are engaged in R&D projects involving advanced technologies in interconnect and packaging of integrated circuits, microsystem assembly, nanoscale, bioMEMS, etc., often through collaboration with industrial partners. Some facilities rent clean room space and equipment, with support from specialized staff.
MiQro Innovation Collaborative Center
The MiQro Innovation Collaborative Centre (C2MI) fosters the growth of the microelectronics industry by supporting its members for advanced packaging development, MEMS development as well as for microsystems prototyping.
Lerner Research Institute
Cleveland Clinic’s laboratory-based, translational and clinical research. Research of BioMEMS technology – for greater functionality and cost reduction in smaller devices for improved medical diagnostics and therapies.
Electronic Microsystems Assembly & Encapsulation Lab (LASEM)
Offering university researchers, grad students and industry members specialized equipment for the design, fabrication and analysis of Microsystems. The platform facilitates collaboration between the university institutions and their industrial partners.
Center for Nanoscale Systems
Focus is on how nanoscale components can be integrated into large and complex interacting systems. The facilities and tools are available for use by US academic or non-academic researchers.
Center for Electronics Manufacturing & Assembly
An academic research lab offering the Electronics Packaging industry research services, failure analysis, training, process development, consulting and laboratory rental.
Center for Intelligent Health Monitoring of Biomechanical and Aerospace systems
Experimental and computational facilities engaged in projects that cover Health Monitoring of Biomechanical and Aerospace systems using micro and Nano Technology remote sensing platforms.
Facility for Interconnect Technology
Develops methods for electrical interconnection for the use in high energy physics experiments and generic particle physics R&D. Includes the bonding of ASICs, detector components, transmission cables, and various package and substrate materials.
A top-rate research fabrication facility for micro and nano-scale processing, including flip chip bonding. Equipment rental at affordable rates with staff that can provide training, process consultation, and tool fixturing.
Electrical & Computer Engineering Research Groups/Labs
Innovative research in nanoelectronics, photovoltaics, sensor and communication networks and superconducting electronics. The ECE groups welcome collaborations with industry in developing new products, technologies and ideas.
A resource for industrial and academic researchers. The lab offers advanced microfabrication and characterization capabilities, supporting the processing of MEMS, microfluidic, micro-optic, photonic and sensor devices.
Center for Nanoscale Science and Engineering
A fully equipped R&D lab for government, industry and academia. Encompasses thin-film, thick film, chip packaging (including flip and direct chip attach) and SMT.