FINETECH provides unique, versatile equipment solutions for flip chip bonding, sub-micron accuracy microelectronic and opto-electronic placement, and advanced rework. Flip chip bonding technologies include eutectic and AuSn soldering, thermo-compression, thermo-sonic / ultrasonic bonding, adhesive, ACP and Chip On Glass. FINETECH’s modular approach allows customization of all systems and provides process flexibility. Ideal for R&D and prototyping through production environments.
Parallel Semiconductor: Advisors to the semiconductor / packaging communities. Parallel Semiconductor LLC was founded in 2007 with a focus on integrated circuit package technology development and intellectual property management for the handheld and portable markets.