Flip Chip - Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting
semiconductor devices, such as IC chips and MEMS …
IC Package Types – A list of package types. Some have standardized dimensions and tolerances, and are registered with
trade industry associations such as JEDEC and Pro Electron …
IC Packaging – Integrated Circuit packaging is the final stage of semiconductor device fabrication, followed by IC testing.
Packaging in ceramic or plastic prevents physical damage and corrosion and supports the electrical contacts required to …
MEMs – Microelectromechanical systems (MEMS) is the technology of very small mechanical devices driven by electricity …
Nanotechnology Applications - Practical nanotechnology is essentially the increasing ability to precisely manipulate matter
on previously impossible scales. The critical length scale of integrated circuits is already at the nanoscale (50 nm and below)…
Package on Package - Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete
logic and memory ball grid array (BGA) packages …
Semiconductor materials – Table of semiconductor materials. The defining property of a semiconductor material is
that it can be doped with impurities that alter its electronic properties in a controllable way…
Solder – Solder is a fusible metal alloy used to join together metal workpieces and having a melting point below that of the workpiece(s).
Thermal Copper Pillar Bump – The thermal copper pillar bump, also known as the “thermal bump”, is a thermoelectric
device made from thin-film thermoelectric material embedded in flip chip interconnects …
Thermosonic Bonding – Thermosonic bonding is widely used to permanently interconnect metallized silicon integrated
circuits (also known as the “chip”) and other components into …
Three-Dimensional Integrated Circuit – A three-dimensional integrated circuit (3D IC, 3D-IC, or 3-D IC) is a chip in
which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit.