Tutorial #1, posted in October 2000, starts with a basic introduction. Subsequent tutorials cover various elements of flip chip processing, updating and supplementing earlier tutorials, and presenting a growing range of micropackaging topics.

New tutorials suitable for review and posting are always welcome. Authors should Email: info (at) flipchips.com.

Select from the tutorial categories below or see the full listing.

- Applications
- Assembly
- Bump Technology
- Process
- Other

Full List of Tutorials

Tutorial 122. Reliability of Flip Chip Assemblies with Lead-Free Solder Bumps  * NEW *
Tutorial 121. Transforming Mobile Electronics Copper Pillar Interconnect
Tutorial 120. Advanced Flip Chip Packaging Platform for Fine Pitch, High Performance Applications
Tutorial 119. Ultra Fine Pitch Cu to Cu, Chip-Last Interconnection
Tutorial 118. Fine Pitch Copper Pillar Flip Chip
Tutorial 117. Optical Package Bonding
Tutorial 116. Gold-to-Gold Bonding Between Thin Layers
Tutorial 115. Improved ENIG Pad Deposition
Tutorial 114. An Introduction to Printed Electronics
Tutorial 113. Oxide Control in Bonding
Tutorial 112. Thermosonic Flip Chip Bonding Update
Tutorial 111. High Reliability Wire Bond and Stud Bump Pads
Tutorial 110. Meniscus-Confined 3D Electrodeposition
Tutorial 109. Damage-Free Plasma Breakthrough
Tutorial 108. Preparing a Flip Chip RDL Mask Set
Tutorial 107. Faster Flip Chip Product Development
Tutorial 106. Optoelectronic Flip Chip Assembly
Tutorial 105. Improved Surface Preparation for Failure Analysis
Tutorial 104. Non-Contact Solder Mask Wafer Bumping
Tutorial 103. Piezoelectrics and Human Body Electricity
Tutorial 102. 3D: Progress and Problems
Tutorial 101. Buckled Pillar Interconnections
Tutorial 100. Flip Chip Update
Tutorial 99. Pressure Control in Flip Chip Assembly
Tutorial 98. Direct Component Printing for Better Rework
Tutorial 97. Via-Through-Pad Advantages
Tutorial 96. Anisotropic Conductive Film for Flip Chip Applications
Tutorial 95. Edge-Bonded Stacked Die
Tutorial 94. Bumping Partial Wafers and Single Die
Tutorial 93. Impoved Jet Dispensing
Tutorial 92. Eutectic Wafer Bonding
Tutorial 91. C4NP Shrinks and Grows
Tutorial 90. 3-D Bonding by Solid-Liquid Interdiffusion
Tutorial 89. Transfer Printing
Tutorial 88. ElectroChemical Pattern Replication
Tutorial 87. Laminated Chip Packages
Tutorial 86. 3D Silicon Chips
Tutorial 85. Chip to Wafer Hermetic Cavity Sealing
Tutorial 84. Avoiding Lead-Free Brittle Fractures
Tutorial 83. Soldering Stud Bumps
Tutorial 82. Putting Photons on the Chip
Tutorial 81. Wafer-level CSP with Integrated Passives
Tutorial 80. Nano-particle Solder Paste
Tutorial 79. Bump Cooling
Tutorial 78. Quilt Packaging
Tutorial 77. Solderless Copper Assembly
Tutorial 76. Jet Dispensing of Underfills
Tutorial 75. Unique Polished Polyimide Substrate
Tutorial 74. High Conductivity Nickel-Fiber ACF
Tutorial 73. Advanced Rework
Tutorial 72. Redistribution Layers
Tutorial 71. Nailing ICs Together
Tutorial 70. Controlled-expansion substrates for WLP
Tutorial 69. Resonance Sensor Technology for Bump Inspection
Tutorial 68. Plasma pretreatment of Flip Chip and CSP assemblies
Tutorial 67. Flip Chip Underfill Processing
Tutorial 66. The Folly of RoHS
Tutorial 65. Cleaning microelectronic devices by Vacuum Cavitational Streaming
Tutorial 64. Silver Nano-platelet Precursors for Ultra-Thin Conductors
Tutorial 63. C4NP Test Data
Tutorial 62. Vapor Jet Deposition of Multi-Metal Films
Tutorial 61. Lead-Free Solder Bumping Methods
Tutorial 60. Nanotube Heat Sinks
Tutorial 59. Lower temperature lead-free flip chip
Tutorial 58. Nanosoldering electronic components at room temperature
Tutorial 57. Thermosonic Bonding of 1,000-bump Flip Chips
Tutorial 56. Injection Molding Solder Bumps
Tutorial 55. The Promise of C4NP
Tutorial 54. Nano Particle Adhesives
Tutorial 53. Probe testing differences in lead-free bumps
Tutorial 52. New Generation Nano-Imprint Lithography System
Tutorial 51. Solder Bumping Single Die
Tutorial 50. Gold Stud Bump Update
Tutorial 49. Wafer-level Nano-optics
Tutorial 48. Drop-in Lead-free solder
Tutorial 47. Flip Chip Bonder for Assembling 3D MEMS
Tutorial 46. Alloy Electroplating: The best solution for Au-Sn solder?
Tutorial 45. Lead-Free Facts and Myths
Tutorial 44. Advanced Wafer-level Cleaning Method
Tutorial 43. Wafer-level Hermetic Cavity Packaging
Tutorial 42. Evaluating Wafer Level Solder Reflow Options to Maximize Yield
Tutorial 41. Hermeticity: much to do about nothing
Tutorial 40. Nano-embossing reaches production
Tutorial 39. Electromigration and Thermomigration in Flip Chip Solder Joints
Tutorial 38. Evaporated Indium Bumps for Flip Chip
Tutorial 37. Too much gold can be a bad thing
Tutorial 36. MEMS Special Packaging Needs
Tutorial 35. Measuring thin films by spectral reflectance, Part 2
Tutorial 34. Sputtered nickel UBM for lead-free solder bumping
Tutorial 33. Conductive Polymer Assembly of High Pin Count Flip Chip
Tutorial 31. Wafer level hermetic cavity chip scale packages for RF
Tutorial 30. Measuring thin films by spectral reflectance, Part 1
Tutorial 29. Micro-Posts: Tall, Slender, Stud Bumps
Tutorial 28. Copper Bumps for Flip Chip Assembly
Tutorial 27. Shaping Gold Ball Bumps
Tutorial 26. The Coming of Copper UBM
Tutorial 25. Low Temperature Flip Chip for Flexible Displays
Tutorial 24. Gold Stud Bump Applications
Tutorial 23. Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies
Tutorial 22. Controlling Stress in Thin Films
Tutorial 21. Probing Bumped Flip Chips
Tutorial 20. Causes of Misalignment
Tutorial 18. Fluxing for Flip Chip
Tutorial 17. SOC, SOP, and WLSCP
Tutorial 16. Packaging, Handling, and Storing of Solder Spheres
Tutorial 15. Substrates for Flip Chip
Tutorial 14. Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms
Tutorial 12. Solder Bumping Step by Step
Tutorial 11. Under Bump Metallization (UBM)
Tutorial 10. Flip Chip Interconnection for Detector Arrays
Tutorial 9. Thermosonic Flip Chip Assembly
Tutorial 8. Reworking Underfilled Flip Chip
Tutorial 7. Electroless Nickel-Gold Flip Chip
Tutorial 6. A Brief History of Flipped Chips
Tutorial 5. Anisotropic Conductive Film (ACF) Flip Chip
Tutorial 4. Solderless Flip Chip (Polymer Bump Flip Chip)
Tutorial 3. Stud Bump Flip Chip
Tutorial 2. Solder Bump Flip Chip
Tutorial 1. Introduction to Flip Chip