Tutorial #120
Raj Pendse, Ph.D. and Mukul Joshi (STATS ChipPAC Inc.)
September 2012

This article discusses a novel advanced flip chip packaging technology that is powerful, flexible and cost-effective. The fcCuBE platform provides compelling advantages over traditional flip chip and allows more control in design cost and performance optimization.  A key attribute of this technology is its inherent scalability to progressively fine pitches and dramatically improved combination of I/O routing density and cost.

Article in Chip Scale Review magazine    ( See page 41 of the issue )