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Anisotropic Conductive Film for Flip Chip Applications: Update

Tutorial #96
Peter J. Opdahl
September 2009

This tutorial covers advances in ACF technology that led to its growing application in high density, low profile, robust and cost-sensitive anisotropic chip-on-board (aCOB) assemblies produced in millions of units per month for cell phone and other high volume products.

tutorial96 PDF_update

For more information:
www.ito-group.com
www.autoacf.com

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