Tutorial #44
Diane Scheele and Thomas Goodman
September 2004
This tutorial describes new resist stripping chemistries required to remove thick resist and to perform well with the higher temperatures of lead-free solders. It appeared in Advanced Packaging Magazine, July 2004, and is linked here with permission of the publisher.
FOR MORE INFORMATION:
Diane Scheele, Director of Technical Services
Dynaloy Inc. PO Box 33609, Indianapolis, IN 46203
dianescheele@dynaloy.com
Thomas Goodman, Managing Partner
E&G Technology Partners LLC,
1840 East Warner Rd. A105, #249, Tempe, AZ 85284 tgoodman@egtechpartners.com